Dage x-ray systems have been specifically and
ergonomically designed for the critical and
demanding test and inspection requirements of the
printed circuit board (PCB) and semiconductor
industries. The superior x-ray image quality and
automated inspection that Dage provides as
standard is achieved through the easiest to use
operator interface in the industry. X-ray tube
resolution can be provided at the microfocus or
sub- micron ('nano-focus') levels. All together, these capabilities are used for
non-destructive, real time failure analysis and
process quality control, especially for tin/lead
and lead-free components that have optically
hidden solder joints, such as Ball Grid Arrays
(BGAs), flip chips and other chip scale packages.
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